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Molybdenum Copper Alloy

Molybdenum Copper Alloy
Molybdenum Copper Alloy

Product Description

Advantages:
Highest thermal conductivity owing to the use of pure Mo and Cu without sintering additives.
Thermal expansion matching that of ceramic materials or semiconductor materials
Cost savings at MoCu by stamping process at higher quantities
Good machinability

Shape and size
Molybdenum- Copper sheets up to 200 x 400 mm, to a thickness of 0.2 to 1.5 mm.

Composite
(wt%)
Mo-15CuMo-20CuMo-25Cu
Density
(g/cm 3 )
109.99.8
TC
(W/ m · K)
160170180
CTE
( × 10 -6 /K)
7.08.09.0
Company: Beijing Wenton Technology Co., Ltd.

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